This unit is used to invert/flip PCB's (180°) for 'double-sided' process.

The shuttle conveyor is used for transporting boards from one line into two lines or vice versa. The orientation of the board is not changed during traversing.

Merlin A-400P is a offline AOI equipment for SMT component inspection and chip component inspection and THT solder joint inspection.The software adopts the function of image comparison for programming, which is simple to……

Falcon SA-510F is a Top AOI equipment for SMT component inspection and chip component inspection.The software adopts the function of image comparison for programming, which is simple to program, it greatly reduce the pro……

M6/M8 is a capable lead free CE certificated reflow oven with 6/8 upper & 6/8 bottom invidual hot air convection zones, pin chain & mesh belt inline conveyor. with accurate and uniform temperature, it can keep pace with ……

E4/E6 is a capable lead free CE certificated reflow oven with 4/6 upper & 4/6 bottom invidual hot air convection zones, pin chain & mesh belt inline conveyor. It's the best choice to go with small volume pick & place mac……

The equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondes……

The equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondes……

SA-500is a AOI equipment for SMT component inspection and chip component inspection. SA-500uses intelligent algorithm which can just click one button for programming, it greatly reduce the programming and debugging work,……

S-350/S-600 series offline SPI were designed to make in-house offline SPI, This series SPI apply to small and normal size PCB, and satisfy customers with small investment to inspect printing quality, moving convenience, ……

The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional g……

This unit can remove glass fiber, dust particles, etc. on top surface of PCB before solder paste printing, and improve production yield. Especially suitable for PCB which is mounted extremely small components.